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Description

Wencon Release agent is used in applications where you need to prevent adhesion between the Wencon repair compound, Coating or Putty and the substrate.

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Instructions for use
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Key technical data

Product numberProduct nameIMPA no.ISSA no.
No. 1110Wencon Release Agent, 50 g unit (0,07 lb)81235075.553.60

50 g unit (0,07 lb)

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