Wencon Rapid is a fast-curing two-component, epoxy compound with a wide range of applications for emergency repairs and maintenance.

Typical applications are emergency repairs, where a short curing time is required to reduce downtime. Wencon Rapid is very suitable for applications where thicker layers of material are required, as the compound quickly sets and becomes solid. The compound can also be used for regular maintenance jobs and as a filling compound.

  •  Fast curing – reduced downtime
  •  Wide range of applications
  •  Strong adhesion to all metal surfaces
  •  Simple mixing and application
  •  Convenient unit sizes


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Instructions for use
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Key technical data

Max temperature+60 - +250°C (140-482°F)
Mixing ratio vol.1:1
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Potlife at 20°C 10-20 min. mixed in small amounts
Curing time40-90 min
Specific volume709 cm3 / kg
Dielectric strength10 KV/mm
Product numbersProduct namesIMPA no.ISSA no.
No. 1000Wencon Rapid, 1 kg (2,2lb) unit81234775.553.21
No. 1005 Wencon Rapid 8, 8x125g (8x0,28 lb) unit81234375.553.22


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